Modeling the entire signal channel, from silicon to silicon, is an increasingly popular way of incorporating the signal integrity performance at speeds above 1 Gb/s. FasTest pioneered this approach 5 years ago, and now offers several options, based on project risk level. Deliverables are generally design rules, and performance budgets for each piece.
 

How do you connect 200 high speed signals between critical instruments? The answer is FastFlexCables. Each one is custom designed for critical test and instrumentation applications. Typical applications include VLSI diagnostic tools.

As high power VLSI chips decrease their operating voltage to less than 1 volt, the need for carefully designed power delivery systems becomes critical. Failure to do this results in poor binning yields, erratic performance. FasTest offers extensive experience in designing power integrity including chip VDD layout and bypassing, package requirements, and PCB power design rules. We even offer a chip 200 A/ns di/dt emulator.

FasTest offers 3D electro-magnetic modeling capability, using a range of tools, including HFSS, Speed, and Momentum. Because these are relatively expensive, they are often reserved for critical models. Deliverables include S-parameters, equivalent circuit models, and modeled results, as needed.